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Protect and secure your BGA chips with our high-quality resin adhesive rework kit. This heat-curing CSP bottom filling epoxy adhesive is designed for precise chip packaging, ensuring reliable and durable protection. Ideal for professional use in electronics and microelectronics.
Made from advanced materials, this adhesive offers excellent thermal and mechanical properties, making it perfect for high-precision applications. Whether you're repairing or packaging BGA chips, this adhesive provides the strength and reliability you need. Trust in our product for your critical electronic projects.
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